Oxygen plasma stripping of photoresist from bipolar integrated circuit wafers - process development
The development of a plasma strip process, in which an oxygen plasma removes photoresist films from etched silicon wafers, is described. The ultimate objective was to demonstrate that dry plasm stripping is a reliable, cost-effective, production-compatible process that does not compromise product re...
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| Format: | Others |
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DigitalCommons@Robert W. Woodruff Library, Atlanta University Center
1981
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| Online Access: | http://digitalcommons.auctr.edu/dissertations/690 http://digitalcommons.auctr.edu/cgi/viewcontent.cgi?article=2228&context=dissertations |