APTMC: AN INTERFACE PROGRAM FOR USE WITH ANSYS FOR THERMAL AND THERMALLY INDUCED STRESS MODELING/SIMULATION OF LEVEL 1 AND LEVEL 2 VLSI PACKAGING
ANSYS Packaging Thermal/Mechanical Calculator (APTMC) is an interface program developed for use with ANSYS and specially designed to handle thermal and thermally induced stress modeling/simulation of Level 1 and Level 2 VLSI packaging structures and assemblies. APTMC is written in PASCAL and operate...
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| Language: | en_US |
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The University of Arizona.
1987
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| Online Access: | http://hdl.handle.net/10150/291399 |