Analysis domain truncation of interconnections in multilayer packaging structures
Interconnect lines, which connect components on a chip, can exhibit transmission line properties. Several factors like decrease in size of components, and decrease in spacing between interconnect lines, have contributed to the increase in importance of interconnect lines. A circuit-analysis approach...
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| Language: | en_US |
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The University of Arizona.
1989
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| Online Access: | http://hdl.handle.net/10150/277078 |