THE HIGH FREQUENCY AND TEMPERATURE DEPENDENCE OF DIELECTRIC PROPERTIES OF PRINTED CIRCUIT BOARD MATERIALS
New VLSI and VHSIC devices require increased performance from electronic packages. The major challenge that must be met in materials/process development for high complexity and high speed integrated circuits is the processing of even larger amounts of signals with low propagation delay. Hence, mater...
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| Language: | en_US |
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The University of Arizona.
1987
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| Online Access: | http://hdl.handle.net/10150/276509 |