Developments of 60 GHz Antenna and Wireless Interconnect inside Multi-Chip Module for Parallel Processor System
In order to carry out the complicated computation inside the high performance computing (HPC) systems, tens to hundreds of parallel processor chips and physical wires are required to be integrated inside the multi-chip package module (MCM). The physical wires considered as the electrical interconnec...
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| Language: | en |
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The University of Arizona.
2013
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| Online Access: | http://hdl.handle.net/10150/272872 |