Evaluation and Modeling of Alternative Copper and Inter-Layer Dielectric Chemical Mechanical Planarization Technologies
The novel consumables studied were abrasive-free copper CMP slurries and high-pressure micro jet technology as an alternative to diamond pad conditioning. Abrasive-free slurries were found to be effective in copper removal and were shown to demonstrate similar removal rate and coefficient of fricti...
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| Language: | EN |
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The University of Arizona.
2006
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| Online Access: | http://hdl.handle.net/10150/195642 |