Design and Characterization of Liquid Metal Flip Chip Interconnections for Heterogeneous Microwave Assemblies
Flip chip interconnections have superior performance for microwave applications compared to wire bond interconnections because of their reduced parasitics, more compact architecture, and flexibility in laying out flip chip bond pads. Reduction in interconnect parasitics enables these interconnects t...
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/50641 |