Thermo-Mechanical Reliability of Sintered-Silver Joint versus Lead-Free Solder for Attaching Large-Area Devices
This study mainly evaluated the thermo-mechanical reliability of lead-free packaging techniques for attaching large-area chip. With 3 MPa pressure, a low-temperature (<300oC) sintering technique enabled by a nano-scale silver paste was developed for attaching 100 mm2 silicon die. This new lead-fr...
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/36429 http://scholar.lib.vt.edu/theses/available/etd-12232010-160602/ |