Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices
This thesis examines the packaging of high-temperature SiC power electronic devices. Current-voltage measurements were conducted on as-received and packaged SiC power devices. The planar structure was introduced and developed as a substitution for traditional wire-bonding vertical structure. The pla...
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en |
| Published: |
Virginia Tech
2014
|
| Subjects: | |
| Online Access: | http://hdl.handle.net/10919/36278 http://scholar.lib.vt.edu/theses/available/etd-12182008-231247/ |