Sintering of Micro-scale and Nanscale Silver Paste for Power Semiconductor Devices Attachment
Die attachment is one of the most important processes in the packaging of power semiconductor devices. The current die-attach materials/techniques, including conductive adhesives and reflowed solders, can not meet the advance of power conversation application. Silver paste sintering has been widel...
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/28902 http://scholar.lib.vt.edu/theses/available/etd-09082005-231429/ |