Processing and Characterization of Device Solder Interconnection and Module Attachment for Power Electronics Modules
This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconne...
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Virginia Tech
2014
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| Online Access: | http://hdl.handle.net/10919/25956 http://scholar.lib.vt.edu/theses/available/etd-0107100-102125/ |