EFFECTS OF SINGLE-EVENT-INDUCED CHARGE SHARING IN SUB-100 NM BULK CMOS TECHNOLOGIES

Sub-100 nm technologies are more vulnerable than older technologies to single event effects (SEE) due to Moore's Law scaling trend. The increased SEE vulnerability has been attributed to the decrease in nodal charge for information storage, reduced nodal separation, and increased switching freq...

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Main Author: Amusan, Oluwole Ayodele
Other Authors: Dr. Mark N. Ellingham
Format: Others
Language:en
Published: VANDERBILT 2009
Subjects:
Online Access:http://etd.library.vanderbilt.edu/available/etd-02162009-141344/
id ndltd-VANDERBILT-oai-VANDERBILTETD-etd-02162009-141344
record_format oai_dc
spelling ndltd-VANDERBILT-oai-VANDERBILTETD-etd-02162009-1413442013-01-08T17:16:27Z EFFECTS OF SINGLE-EVENT-INDUCED CHARGE SHARING IN SUB-100 NM BULK CMOS TECHNOLOGIES Amusan, Oluwole Ayodele Electrical Engineering Sub-100 nm technologies are more vulnerable than older technologies to single event effects (SEE) due to Moore's Law scaling trend. The increased SEE vulnerability has been attributed to the decrease in nodal charge for information storage, reduced nodal separation, and increased switching frequency. The effect of the reduced nodal separation is the increased probability of simultaneous charge collection at several nodes from a single ion-strike (called charge sharing). Charge sharing is a significant SEE issue because it can render circuit-level hardening techniques ineffective. Conventional SEE radiation-hardened by design (RHBD) approaches provide excellent protection against single event upsets (SEU) resulting from charge collection occurs on a single node. However, for sub-100 nm technologies, the probability of multiple node charge collection is significant, thwarting RHBD protection. As CMOS processes continue to scale, there is a continued decrease in nodal pitch, but virtually no change in the charge generation radius of the heavy-ion strike. Hence, charge sharing is a troubling reliability roadblock for advanced technologies. This dissertation introduces and details the charge sharing effect. It examines through finite element simulations, focused laser testing, and broadbeam heavy ion experiments the effects of charge sharing at the 130 nm and 90 nm CMOS technology nodes. Results include quantification of the all-important angle of incidence on device and circuit response. Further, this dissertation examines the effectiveness of several charge sharing mitigation techniques. The work presented in this dissertation directly impacts the SEE qualification techniques used by the radiation community for sub-100 nm technologies. The mitigation techniques proposed and verified are useful for improving the radiation hardness of advanced technologies, and provide designers with design guidelines applicable to space-deployed applications. Dr. Mark N. Ellingham Dr. Michael L. Alles Dr. Arthur F. Witulski Dr. Bharat L. Bhuva Dr. Lloyd W. Massengill VANDERBILT 2009-02-16 text application/pdf http://etd.library.vanderbilt.edu/available/etd-02162009-141344/ http://etd.library.vanderbilt.edu/available/etd-02162009-141344/ en unrestricted I hereby certify that, if appropriate, I have obtained and attached hereto a written permission statement from the owner(s) of each third party copyrighted matter to be included in my thesis, dissertation, or project report, allowing distribution as specified below. I certify that the version I submitted is the same as that approved by my advisory committee. I hereby grant to Vanderbilt University or its agents the non-exclusive license to archive and make accessible, under the conditions specified below, my thesis, dissertation, or project report in whole or in part in all forms of media, now or hereafter known. I retain all other ownership rights to the copyright of the thesis, dissertation or project report. I also retain the right to use in future works (such as articles or books) all or part of this thesis, dissertation, or project report.
collection NDLTD
language en
format Others
sources NDLTD
topic Electrical Engineering
spellingShingle Electrical Engineering
Amusan, Oluwole Ayodele
EFFECTS OF SINGLE-EVENT-INDUCED CHARGE SHARING IN SUB-100 NM BULK CMOS TECHNOLOGIES
description Sub-100 nm technologies are more vulnerable than older technologies to single event effects (SEE) due to Moore's Law scaling trend. The increased SEE vulnerability has been attributed to the decrease in nodal charge for information storage, reduced nodal separation, and increased switching frequency. The effect of the reduced nodal separation is the increased probability of simultaneous charge collection at several nodes from a single ion-strike (called charge sharing). Charge sharing is a significant SEE issue because it can render circuit-level hardening techniques ineffective. Conventional SEE radiation-hardened by design (RHBD) approaches provide excellent protection against single event upsets (SEU) resulting from charge collection occurs on a single node. However, for sub-100 nm technologies, the probability of multiple node charge collection is significant, thwarting RHBD protection. As CMOS processes continue to scale, there is a continued decrease in nodal pitch, but virtually no change in the charge generation radius of the heavy-ion strike. Hence, charge sharing is a troubling reliability roadblock for advanced technologies. This dissertation introduces and details the charge sharing effect. It examines through finite element simulations, focused laser testing, and broadbeam heavy ion experiments the effects of charge sharing at the 130 nm and 90 nm CMOS technology nodes. Results include quantification of the all-important angle of incidence on device and circuit response. Further, this dissertation examines the effectiveness of several charge sharing mitigation techniques. The work presented in this dissertation directly impacts the SEE qualification techniques used by the radiation community for sub-100 nm technologies. The mitigation techniques proposed and verified are useful for improving the radiation hardness of advanced technologies, and provide designers with design guidelines applicable to space-deployed applications.
author2 Dr. Mark N. Ellingham
author_facet Dr. Mark N. Ellingham
Amusan, Oluwole Ayodele
author Amusan, Oluwole Ayodele
author_sort Amusan, Oluwole Ayodele
title EFFECTS OF SINGLE-EVENT-INDUCED CHARGE SHARING IN SUB-100 NM BULK CMOS TECHNOLOGIES
title_short EFFECTS OF SINGLE-EVENT-INDUCED CHARGE SHARING IN SUB-100 NM BULK CMOS TECHNOLOGIES
title_full EFFECTS OF SINGLE-EVENT-INDUCED CHARGE SHARING IN SUB-100 NM BULK CMOS TECHNOLOGIES
title_fullStr EFFECTS OF SINGLE-EVENT-INDUCED CHARGE SHARING IN SUB-100 NM BULK CMOS TECHNOLOGIES
title_full_unstemmed EFFECTS OF SINGLE-EVENT-INDUCED CHARGE SHARING IN SUB-100 NM BULK CMOS TECHNOLOGIES
title_sort effects of single-event-induced charge sharing in sub-100 nm bulk cmos technologies
publisher VANDERBILT
publishDate 2009
url http://etd.library.vanderbilt.edu/available/etd-02162009-141344/
work_keys_str_mv AT amusanoluwoleayodele effectsofsingleeventinducedchargesharinginsub100nmbulkcmostechnologies
_version_ 1716533257739173888