Using IEEE 1500 for wafer testing of TSV Based 3D integrated circuits
The potential end of Moore's law has caused the semiconductor industry to investigate 3D integrated circuits as a way to continue to increase transistor density. Solutions must be put in place to allow each 3D IC die layer to be tested thoroughly on its own at wafer level to unsure adequate yie...
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| Format: | Others |
| Language: | English |
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2012
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| Online Access: | http://hdl.handle.net/2152/ETD-UT-2011-12-4471 |