Humidity effects on hygroscopic particles deposited on HEPA filters and silicon wafer surfaces
Semiconductor wafer manufacturing facilities (fab) must maintain extremely clean air environments to minimize the number of wafers scrapped due to contamination which would result in reduced yields. The fab air is cleaned bypassing it through either HEPA or ULPA filters. A number of airborne fab con...
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| Format: | Others |
| Language: | en_US |
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2013
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| Online Access: | http://hdl.handle.net/2152/20008 |