Thermo-Mechanical Reliability of Micro-Interconnects in Three-Dimensional Integrated Circuits: Modeling and Simulation
Three-dimensional integrated circuits (3D ICs) have been designed with the purpose of achieving higher communication speed by reducing the interconnect length between integrated circuits, and integrating heterogeneous functions into one single package, among other advantages. As a growing, new techn...
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| Format: | Others |
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DigitalCommons@USU
2010
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| Online Access: | https://digitalcommons.usu.edu/etd/737 https://digitalcommons.usu.edu/cgi/viewcontent.cgi?article=1733&context=etd |