Analysis of Printed Electronic Adhesion, Electrical, Mechanical, and Thermal Performance for Resilient Hybrid Electronics
Today’s state of the art additive manufacturing (AM) systems have the ability to fabricate multi-material devices with novel capabilities that were previously constrained by traditional manufacturing. AM machines fuse or deposit material in an additive fashion only where necessary, thus unlocking ad...
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| Format: | Others |
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Scholar Commons
2018
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| Online Access: | https://scholarcommons.usf.edu/etd/7551 https://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=8748&context=etd |