Detection of Cracks in Single-Crystalline Silicon Wafers Using Impact Testing
This thesis is about detection of cracks in single-crystalline silicon wafers by using a vibration method in the form of an impact test. The goal to detect cracks from vibration measurements introduced by striking the silicon wafer with an impact hammer. Such a method would reduce costs in the produ...
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| Format: | Others |
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Scholar Commons
2006
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| Online Access: | http://scholarcommons.usf.edu/etd/3789 http://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=4985&context=etd |