Growth of 3C-SiC via a hot-wall CVD reactor

The heteroepitaxial growth of cubic silicon carbide (3C-SiC) on silicon (Si) substrates at high growth rates, via a horizontal hot-wall chemical vapor deposition (CVD) reactor, has been achieved. The final growth process was developed in three stages; an initial "baseline" development stag...

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Main Author: Harvey, Suzie
Format: Others
Published: Scholar Commons 2006
Subjects:
SOI
Online Access:http://scholarcommons.usf.edu/etd/2552
http://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=3551&context=etd
id ndltd-USF-oai-scholarcommons.usf.edu-etd-3551
record_format oai_dc
spelling ndltd-USF-oai-scholarcommons.usf.edu-etd-35512015-09-30T04:39:37Z Growth of 3C-SiC via a hot-wall CVD reactor Harvey, Suzie The heteroepitaxial growth of cubic silicon carbide (3C-SiC) on silicon (Si) substrates at high growth rates, via a horizontal hot-wall chemical vapor deposition (CVD) reactor, has been achieved. The final growth process was developed in three stages; an initial "baseline" development stage, an optimization stage, and a large area growth stage. In all cases the growth was conducted using a two step, carbonization plus growth, process. During carbonization, the surface of the Si is converted to 3C-SiC, which helps to minimize the stress in the growing crystal. Propane (C3H8) and silane (SiH4), diluted in hydrogen (H2), were used as the carbon and silicon source, respectively. A deposition rate of approximately 10 um/h was established during the baseline process. Once the baseline process proved to be repeatable, optimization of the process began. Through variations in temperature, pressure, and the Si/C ratio, thick 3C-SiC films (up to 22 um thick) and high deposition rates (up to 30 um/h) were obtained. The optimized process was then applied to growth on 50 mm diameter Si(100) wafers. The grown 3C-SiC films were analyzed using a variety of characterization techniques. The thickness of the films was assessed through Fourier Transform infrared (FTIR) spectroscopy, and confirmed by cross-section scanning electron microscopy (SEM). The SEM cross-sections were also used to investigate the 3C-SiC/Si interface. The surface morphology of the films was inspected via Nomarsky interference optical microscopy, atomic force microscopy (AFM), and SEM. The crystalline quality of the films was determined through X-ray diffraction (XRD) and low-temperature photoluminescence (LTPL) analysis. A mercury probe was used to make non-contact CV/IV measurements and determine the film doping. 2006-06-01T07:00:00Z text application/pdf http://scholarcommons.usf.edu/etd/2552 http://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=3551&context=etd default Graduate Theses and Dissertations Scholar Commons Silicon carbide Heteroepitaxy SOI Crystal defects Chemical vapor deposition American Studies Arts and Humanities
collection NDLTD
format Others
sources NDLTD
topic Silicon carbide
Heteroepitaxy
SOI
Crystal defects
Chemical vapor deposition
American Studies
Arts and Humanities
spellingShingle Silicon carbide
Heteroepitaxy
SOI
Crystal defects
Chemical vapor deposition
American Studies
Arts and Humanities
Harvey, Suzie
Growth of 3C-SiC via a hot-wall CVD reactor
description The heteroepitaxial growth of cubic silicon carbide (3C-SiC) on silicon (Si) substrates at high growth rates, via a horizontal hot-wall chemical vapor deposition (CVD) reactor, has been achieved. The final growth process was developed in three stages; an initial "baseline" development stage, an optimization stage, and a large area growth stage. In all cases the growth was conducted using a two step, carbonization plus growth, process. During carbonization, the surface of the Si is converted to 3C-SiC, which helps to minimize the stress in the growing crystal. Propane (C3H8) and silane (SiH4), diluted in hydrogen (H2), were used as the carbon and silicon source, respectively. A deposition rate of approximately 10 um/h was established during the baseline process. Once the baseline process proved to be repeatable, optimization of the process began. Through variations in temperature, pressure, and the Si/C ratio, thick 3C-SiC films (up to 22 um thick) and high deposition rates (up to 30 um/h) were obtained. The optimized process was then applied to growth on 50 mm diameter Si(100) wafers. The grown 3C-SiC films were analyzed using a variety of characterization techniques. The thickness of the films was assessed through Fourier Transform infrared (FTIR) spectroscopy, and confirmed by cross-section scanning electron microscopy (SEM). The SEM cross-sections were also used to investigate the 3C-SiC/Si interface. The surface morphology of the films was inspected via Nomarsky interference optical microscopy, atomic force microscopy (AFM), and SEM. The crystalline quality of the films was determined through X-ray diffraction (XRD) and low-temperature photoluminescence (LTPL) analysis. A mercury probe was used to make non-contact CV/IV measurements and determine the film doping.
author Harvey, Suzie
author_facet Harvey, Suzie
author_sort Harvey, Suzie
title Growth of 3C-SiC via a hot-wall CVD reactor
title_short Growth of 3C-SiC via a hot-wall CVD reactor
title_full Growth of 3C-SiC via a hot-wall CVD reactor
title_fullStr Growth of 3C-SiC via a hot-wall CVD reactor
title_full_unstemmed Growth of 3C-SiC via a hot-wall CVD reactor
title_sort growth of 3c-sic via a hot-wall cvd reactor
publisher Scholar Commons
publishDate 2006
url http://scholarcommons.usf.edu/etd/2552
http://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=3551&context=etd
work_keys_str_mv AT harveysuzie growthof3csicviaahotwallcvdreactor
_version_ 1716825076926513152