Process optimization and consumable development for Chemical Mechanical Planarization (CMP) processes
Chemical Mechanical Planarization (CMP) is one of the most critical processing steps that enables fabrication of multilevel interconnects. The success of CMP process is limited by the implementation of an optimized process and reduction of process generated defects along with post CMP surface charac...
| Main Author: | |
|---|---|
| Format: | Others |
| Published: |
Scholar Commons
2007
|
| Subjects: | |
| Online Access: | http://scholarcommons.usf.edu/etd/2295 http://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=3294&context=etd |