Adhesion Comparison of Low Dielectric Constant Thin Films Using Four Point Bend and Nanoscratch Testing
As the semiconductor technology moves further into scaled down device structures, modern day complexities in the fabrication processes become more prevalent. This thesis focuses on the issues associated with mechaincal and adhesion failure in low dielectric constant (low-k) thin films. In this thesi...
| Main Author: | |
|---|---|
| Format: | Others |
| Published: |
Scholar Commons
2008
|
| Subjects: | |
| Online Access: | https://scholarcommons.usf.edu/etd/547 https://scholarcommons.usf.edu/cgi/viewcontent.cgi?article=1546&context=etd |