Indium Bump Fabrication using Electroplating for Flip Chip Bonding
Hybrid pixel detectors are widely used in many fields, including military, environment, industry and medical treatment. When integrating such a detector, a vertical connection technique called flip-chip bonding is almost the only way to realize the high-density interconnection between each pixel det...
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| Format: | Others |
| Language: | English |
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Mittuniversitetet, Avdelningen för elektronikkonstruktion
2015
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:miun:diva-27939 |