Thermal Issues in Testing of Advanced Systems on Chip

Thermal Issues in Testing of Advanced Systems on Chip

Many cutting-edge computer and electronic products are powered by advanced Systems-on-Chip (SoC). Advanced SoCs encompass superb performance together with large number of functions. This is achieved by efficient integration of huge number of transistors. Such very large scale integration is enabled...

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Bibliographic Details
Main Author: Aghaee Ghaleshahi, Nima
Format: Doctoral Thesis
Language:English
Published: Linköpings universitet, Institutionen för datavetenskap 2015
Subjects:
SoC test
test scheduling
Adaptive test
Temperature awareness
Process variation
Thermal simulation
3D stacked IC (3DSIC) test
Burn-in
Temperature gradients
Temperature Cycling Test
Test Ordering
Online Access:http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-120798
http://nbn-resolving.de/urn:isbn:978-91-7685-949-0 (print)

Internet

http://urn.kb.se/resolve?urn=urn:nbn:se:liu:diva-120798
http://nbn-resolving.de/urn:isbn:978-91-7685-949-0 (print)

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