Investigation of Wafer Level Au-Si Eutectic Bonding of Shape Memory Alloy (SMA) with Silicon
The objective of this research work was to investigate the low temperature gold silicon eutectic bonding of SMA with silicon wafers. The research work was carried out to optimize a bond process with better yield and higher bond strength. The gold layer thickness, processing temperature, diffusion ba...
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| Format: | Others |
| Language: | English |
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KTH, Mikrosystemteknik
2011
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-55483 |