Micro Assembly for Radio Frequency Electronics : Characterization of Bond Wires
Due to the increasing number of components involved in Radio Frequency design, integration and packaging become an important topic of developing power-efficient and cost-effective solutions. Furthermore, interconnections are a key factor in such a topic because they are heavily used in Radio Frequen...
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| Format: | Others |
| Language: | English |
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KTH, Skolan för elektroteknik och datavetenskap (EECS)
2019
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-257875 |