High Temperature Bipolar SiC Power Integrated Circuits

In the recent decade, integrated electronics in wide bandgap semiconductor technologies such as Gallium Nitride (GaN) and Silicon Carbide (SiC) have been shown to be viable candidates in extreme environments (e.g high-temperature and high radiation). Such electronics have applications in down-hole d...

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Main Author: Kargarrazi, Saleh
Format: Doctoral Thesis
Language:English
Published: KTH, Integrerade komponenter och kretsar 2017
Online Access:http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-201618
http://nbn-resolving.de/urn:isbn:978-91-7729-262-3
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spelling ndltd-UPSALLA1-oai-DiVA.org-kth-2016182017-02-16T05:19:16ZHigh Temperature Bipolar SiC Power Integrated CircuitsengKargarrazi, SalehKTH, Integrerade komponenter och kretsarStockholm2017In the recent decade, integrated electronics in wide bandgap semiconductor technologies such as Gallium Nitride (GaN) and Silicon Carbide (SiC) have been shown to be viable candidates in extreme environments (e.g high-temperature and high radiation). Such electronics have applications in down-hole drilling, automobile-, air- and space- industries. In this thesis, integrated circuits (ICs) in bipolar 4H-SiC for high-temperature power applications are explored. In particular, device modelling, circuit design, layout design, and measurements are discussed for a range of circuits including operational amplifiers, linear voltage regulators, drivers for power switches, and power converters with integrated control. The circuits were demonstrated and tested from 25 °C up to 500 °C. Circuit design in bipolar SiC technology involves challenges such as the fabrication process’ uncertainties and incomplete models of the devices. Furthermore, high temperature modelling of the integrated devices is needed for circuit design and simulation. From the circuit design viewpoint, techniques such as negative-feedback, temperature-insensitive biasing, buffering and Darlington stages, and amplifiers with fewer gain stages, were shown to be useful for high-temperature IC design in bipolar SiC. It is shown that the linear voltage regulator can be improved by using a tailored high-current lateral Darlington power device in the same fabrication process. This results in a high temperature high current power supply solution. Moreover, the drivers can be improved by design in order to provide higher voltage levels and peak currents for the power devices (bipolar and MOSFET based). In addition, a DC-DC converter with fully integrated hysteretic control is designed taking advantage of several sub-circuits such as operational amplifier, Schmitt trigger and driver for the power switch. This study is followed by preliminary experimental results for the converter and controller IC. <p>QC 20170213</p>Doctoral thesis, monographinfo:eu-repo/semantics/doctoralThesistexthttp://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-201618urn:isbn:978-91-7729-262-3TRITA-ICT ; 2017:05application/pdfinfo:eu-repo/semantics/openAccess
collection NDLTD
language English
format Doctoral Thesis
sources NDLTD
description In the recent decade, integrated electronics in wide bandgap semiconductor technologies such as Gallium Nitride (GaN) and Silicon Carbide (SiC) have been shown to be viable candidates in extreme environments (e.g high-temperature and high radiation). Such electronics have applications in down-hole drilling, automobile-, air- and space- industries. In this thesis, integrated circuits (ICs) in bipolar 4H-SiC for high-temperature power applications are explored. In particular, device modelling, circuit design, layout design, and measurements are discussed for a range of circuits including operational amplifiers, linear voltage regulators, drivers for power switches, and power converters with integrated control. The circuits were demonstrated and tested from 25 °C up to 500 °C. Circuit design in bipolar SiC technology involves challenges such as the fabrication process’ uncertainties and incomplete models of the devices. Furthermore, high temperature modelling of the integrated devices is needed for circuit design and simulation. From the circuit design viewpoint, techniques such as negative-feedback, temperature-insensitive biasing, buffering and Darlington stages, and amplifiers with fewer gain stages, were shown to be useful for high-temperature IC design in bipolar SiC. It is shown that the linear voltage regulator can be improved by using a tailored high-current lateral Darlington power device in the same fabrication process. This results in a high temperature high current power supply solution. Moreover, the drivers can be improved by design in order to provide higher voltage levels and peak currents for the power devices (bipolar and MOSFET based). In addition, a DC-DC converter with fully integrated hysteretic control is designed taking advantage of several sub-circuits such as operational amplifier, Schmitt trigger and driver for the power switch. This study is followed by preliminary experimental results for the converter and controller IC. === <p>QC 20170213</p>
author Kargarrazi, Saleh
spellingShingle Kargarrazi, Saleh
High Temperature Bipolar SiC Power Integrated Circuits
author_facet Kargarrazi, Saleh
author_sort Kargarrazi, Saleh
title High Temperature Bipolar SiC Power Integrated Circuits
title_short High Temperature Bipolar SiC Power Integrated Circuits
title_full High Temperature Bipolar SiC Power Integrated Circuits
title_fullStr High Temperature Bipolar SiC Power Integrated Circuits
title_full_unstemmed High Temperature Bipolar SiC Power Integrated Circuits
title_sort high temperature bipolar sic power integrated circuits
publisher KTH, Integrerade komponenter och kretsar
publishDate 2017
url http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-201618
http://nbn-resolving.de/urn:isbn:978-91-7729-262-3
work_keys_str_mv AT kargarrazisaleh hightemperaturebipolarsicpowerintegratedcircuits
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