Metal Filling of Through Silicon Vias (TSVs) using Wire Bonding Technology
Through Silicon Vias (TSVs) are vertical interconnections providing the shortest possible signal paths between vertically stacked chips in 3D packaging. In this thesis, TSVs are fabricated and two novel approaches for the metal filling of TSVs are investigated. A wire bonder is utilized to apply TSV...
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| Format: | Others |
| Language: | English |
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KTH, Mikro- och nanosystemteknik
2014
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| Online Access: | http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-145552 |