Wafer-level heterogeneous integration of MEMS actuators

Wafer-level heterogeneous integration of MEMS actuators

This thesis presents methods for the wafer-level integration of shape memory alloy (SMA) and electrostatic actuators to functionalize MEMS devices. The integration methods are based on heterogeneous integration, which is the integration of different materials and technologies. Background information...

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Bibliographic Details
Main Author: Braun, Stefan
Format: Doctoral Thesis
Language:English
Published: KTH, Mikrosystemteknik 2010
Subjects:
Microelectromechanical systems
MEMS
silicon
wafer-level
integration
heterogeneous integration
transfer integration
packaging
assembly
wafer bonding
adhesive bonding
eutectic bonding
release etching
electrochemical etching
microvalves
microactuator
Shape Memory Alloy
SMA
NITINOL
TiNi
NiTi
cold-state reset
bias spring
stress layers
crossbar switch
routing
switch
switch array
electrostatic actuator
S-shaped actuator
zipper actuator
addressing
transfer stamping
blue tape
Computer engineering
Datorteknik
Online Access:http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-11833
http://nbn-resolving.de/urn:isbn:978-91-7415-493-1

Internet

http://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-11833
http://nbn-resolving.de/urn:isbn:978-91-7415-493-1

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