Reactive deposition of pure and alloyed cobalt and nickel thin films from supercritical carbon dioxide solutions
The need for faster and smaller integrated circuits and other devices is necessitating deposition of interconnect materials in increasingly narrow high aspect ratio features, a demand that can not be fully realized by current techniques. Traditional metal deposition techniques such as plating and CV...
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| Language: | ENG |
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ScholarWorks@UMass Amherst
2004
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| Online Access: | https://scholarworks.umass.edu/dissertations/AAI3136740 |