A systematic study of silicon germanium interdiffusion for next generation semiconductor devices

SiGe heterostructures with higher Ge fractions and larger Ge modulations, and thus higher compressive stress, are key structures for next-generation electronic and optoelectronic devices. Si-Ge interdiffusion during high temperature growth or fabrication steps changes the distribution of Ge fraction...

Full description

Bibliographic Details
Main Author: Dong, Yuanwei
Language:English
Published: University of British Columbia 2014
Online Access:http://hdl.handle.net/2429/47120