A network approach for thermo-electrical modelling : from IC interconnects to textile composites
Simulations of the temperature distribution in regular IC interconnect networks and textile composites are achieved by means of an analytical-symbolic approach. Analytical heating solutions along each interconnect can provide accurate solutions with far fewer nodes than numerical solutions. To simul...
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| Language: | English |
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University of British Columbia
2010
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| Online Access: | http://hdl.handle.net/2429/28471 |