Application of Design of Experiments to Improving Copper Film Uniformity for Panel-Level Electroplating Process - A Case Study of X Company

• Main Authors: Tseng, Chien-Chou, 曾建洲
• Other Authors: Chang, Yung-Chia
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/6kkt88

碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 108 === Wafer Level Package(WLP), is one of the sections in the semiconductor electric package domain, another developed domain is Panel Level Package(PLP), which having 95% using efficiency of the squared substrate that is very helpful to the productivity improvement and the reduce of the assembly cost. Therefore, the development of the PLP will be the tendency for the technical of packages in the future. In the assembly process of the PLP, the copper plating process plays the most important role, but the risk is that the plating on the larger size substrate would probably cause the nonuniform plating and result peeling. The study of this thesis based on the plating apparatus that was co-work with company X. Through the appearance of the nonuniform copper plating in the assembly process to find the factors of the problems, and analyzed the factors with the Response Surface Methodology then executed experiments, the experiment aimed to obtain the optimized term to improve the nonuniform problem by investigating the relationship between the combination of the factors with the uniformity of copper plating. After all the tests and Central Composite Designs(CCD) accomplished, the conclusion showed that the uniformity of the copper plating could be improved as well.