Cu(Mn) Alloy Thin Film Prepared by Using Cu to Replace Underpotential Deposited Mn Through Surface-limited Redox Replacement
碩士 === 國立虎尾科技大學 === 材料科學與工程系材料科學與綠色能源工程碩士班 === 107 === Use of self-forming Cu alloy thin film is essential for application in state-of-the-art Cu interconnects due to the high aspect ratio of the trenches/vias. The self-forming Cu alloy thin film can be a barrier to prevent Cu diffusion after anneal...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9z785z |