The Effect of Surface Roughness of Polyimide Layer on Underfill Delamination

• Main Authors: DONG,ZI-YI, 董芓儀
• Other Authors: SHIH,MING-CHANG
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/g2g26r

碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 107 === Due to the increasing demand for the functionality of a single product, large products have become a trend. However, as the product size increases, the thermal expansion between the layers of the material will become more and more critical thus resulting in an increased risk of stress after flip chip process. Among them, the problem of delamination between the polyimide layer and the underfill is the most difficult to solved. In this thesis, we study the effect of the surface roughness of the polyimine layer to delamination of the underfill by controlling the time of bumping descum process; a surface treatment by plasma. As the result, the reliability test and the final test proved that the delamination of the underfill can be effectively solved by improve the surface roughness of the polyimide.