The Effect of Surface Roughness of Polyimide Layer on Underfill Delamination
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 107 === Due to the increasing demand for the functionality of a single product, large products have become a trend. However, as the product size increases, the thermal expansion between the layers of the material will become more and more critical thus res...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/g2g26r |