The Study of Laser Cutting Parameters for The CSP Package

• Main Authors: WU, CHUN-HSIEN, 吳俊賢
• Other Authors: SHIH, MING-CHANG
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/c96jp8

碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 107 === Flip Chip packaging has become the most efficient structure of high-performance IC packaging. While the package structure become smaller and thinner, it is a challenge of substrate cutting by mechanical method. Recently, laser technology have been widely applied in IC packaging due to the high efficient of material selectivity and high resolution. In this thesis, we focus on the study of laser cutting in CSP substrate processing. Parameters of laser processing such as pulse frequency, speed and loops were examined by Takuchi method to achieve optimized cutting edges of the substrate. As a result that laser cutting parameters with pulse frequency at 400 Hz, writing speed at 300 mm/s, and loops number of 5 is able to achieve the optimized cutting edge of the substrate. In general, under constant laser power the parameters of pulse frequencies and writing speed do not contribute significant variation of the cutting edge quality, but the loops number can make significant changes of the cutting edge quality.