The Study of Laser Cutting Parameters for The CSP Package
碩士 === 國立高雄大學 === 電機工程學系-電子構裝整合技術產業碩士專班 === 107 === Flip Chip packaging has become the most efficient structure of high-performance IC packaging. While the package structure become smaller and thinner, it is a challenge of substrate cutting by mechanical method. Recently, laser technology have been...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/c96jp8 |