Mechanical Behaviors of Cu6Sn5 in 3D IC Micro JointsUsing Micropillar Compression
博士 === 國立臺灣大學 === 材料科學與工程學研究所 === 107 === As semiconductor industry is confronted with the challenge of physical limit in scaling down transistor size, three dimensional integrated circuits (3D ICs) serve as one of the most promising technologies to extend Moore’s law (More-Moore) or even go More-th...
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| Format: | Others |
| Language: | en_US |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/hvvnmy |