Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model

碩士 === 國立清華大學 === 動力機械工程學系 === 107

Bibliographic Details
Main Authors:	Chou, Pei-Hsun, 周佩勲
Other Authors:	Chiang, Kuo-Ning
Format:	Others
Language:	zh-TW
Published:	2019
Online Access:	http://ndltd.ncl.edu.tw/handle/q56nj7

id	ndltd-TW-107NTHU5311014
record_format	oai_dc
spelling	ndltd-TW-107NTHU53110142019-05-30T03:57:30Z http://ndltd.ncl.edu.tw/handle/q56nj7 Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model 以人工神經網路回歸模型評估晶圓級封裝之可靠度 Chou, Pei-Hsun 周佩勲碩士國立清華大學動力機械工程學系 107 Chiang, Kuo-Ning 江國寧 2019 學位論文 ; thesis 106 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立清華大學 === 動力機械工程學系 === 107
author2	Chiang, Kuo-Ning
author_facet	Chiang, Kuo-Ning Chou, Pei-Hsun 周佩勲
author	Chou, Pei-Hsun 周佩勲
spellingShingle	Chou, Pei-Hsun 周佩勲 Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model
author_sort	Chou, Pei-Hsun
title	Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model
title_short	Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model
title_full	Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model
title_fullStr	Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model
title_full_unstemmed	Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model
title_sort	reliability assessment of wafer level package using artificial neural network regression model
publishDate	2019
url	http://ndltd.ncl.edu.tw/handle/q56nj7
work_keys_str_mv	AT choupeihsun reliabilityassessmentofwaferlevelpackageusingartificialneuralnetworkregressionmodel AT zhōupèixūn reliabilityassessmentofwaferlevelpackageusingartificialneuralnetworkregressionmodel AT choupeihsun yǐréngōngshénjīngwǎnglùhuíguīmóxíngpínggūjīngyuánjífēngzhuāngzhīkěkàodù AT zhōupèixūn yǐréngōngshénjīngwǎnglùhuíguīmóxíngpínggūjīngyuánjífēngzhuāngzhīkěkàodù
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Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model

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