Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model

碩士 === 國立清華大學 === 動力機械工程學系 === 107

Bibliographic Details
Main Authors: Chou, Pei-Hsun, 周佩勲
Other Authors: Chiang, Kuo-Ning
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/q56nj7