Reliability Assessment of Wafer Level Package using Artificial Neural Network Regression Model

• Main Authors: Chou, Pei-Hsun, 周佩勲
• Other Authors: Chiang, Kuo-Ning
• Format: Others
• Language: zh-TW
• Published: 2019
• Online Access: http://ndltd.ncl.edu.tw/handle/q56nj7

碩士 === 國立清華大學 === 動力機械工程學系 === 107