Path planning of wafer probe by reinforcement learning
碩士 === 國立中山大學 === 電機工程學系研究所 === 107 === At present, industries generally conduct wafer probing with the use of automated test equipment, and switches to manual processing when testing on odd dice. This way of testing reduces the efficiency of the test equipment. This thesis uses the method of reinfo...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2019
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Online Access: | http://ndltd.ncl.edu.tw/handle/8g6s64 |