Path planning of wafer probe by reinforcement learning

碩士 === 國立中山大學 === 電機工程學系研究所 === 107 === At present, industries generally conduct wafer probing with the use of automated test equipment, and switches to manual processing when testing on odd dice. This way of testing reduces the efficiency of the test equipment. This thesis uses the method of reinfo...

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Bibliographic Details
Main Authors: Yu-Syuan Weng, 翁雨玄
Other Authors: Kao-Shing Hwang
Format: Others
Language:zh-TW
Published: 2019
Online Access:http://ndltd.ncl.edu.tw/handle/8g6s64