Feasibility and Reliability Test Analysis of Chemical Dipping De-flash SHD-302K for Top Side Mold Flash
碩士 === 國立高雄科技大學 === 化學工程與材料工程系 === 107 === This research focused on the chemical dipping de-flashes process. The top side mold flash is one of the common defects after epoxy molding process. Chemical dipping de-flash was used to eliminate the top side molding compound residue in order to facilitate...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/74nx9w |