The Palladium Distribution Electronic Flame Off (EFO) Parameter of the Palladium Coated Copper Wire
碩士 === 國立高雄科技大學 === 化學工程與材料工程系 === 107 === Wire bonding process is the most extensive and important used in bonding technique for the packaging industry. The material of gold connection is still on the top of the list when designing in a circuit. However to stay in competitiveness and in considerati...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/vcatvw |