| Summary: | 碩士 === 國立高雄科技大學 === 工業工程與管理系 === 107 === This paper focuses on the wire materials change from widely used Au wire, Ag alloy wire, bare Cu wire, Pd-Cu wire to Au Pd-Cu wire in wire bonding processing of Semiconductor Assembly. The reason why various materials appear is due to the consideration on cost. Currently, the electrical products’ body sizes become smaller and the prices also become cheaper. As a result, the change on material can improve the overall cost. Under the premise that it can meet the requirement of lowing cost and maintaining the quality, not only needs the improvement of process but also the material development.
This research will take the new Au Pd-Cu wire as the major research material. Comparing with the bare Cu wire and Pd-Cu wire, the workability and the reliability of Au Pd-Cu wire are more prominent. This study shows that Au Pd-Cu wires have better distribution on wire surface, and also enhance the reliability to achieve the requirement of high reliability.
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