Reliability Test about AuPdCu Wire Materials of Wire Bonding Processing in Semiconductor Assembly
碩士 === 國立高雄科技大學 === 工業工程與管理系 === 107 === This paper focuses on the wire materials change from widely used Au wire, Ag alloy wire, bare Cu wire, Pd-Cu wire to Au Pd-Cu wire in wire bonding processing of Semiconductor Assembly. The reason why various materials appear is due to the consideration on cos...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23aw6u |