The Research of Improving the Cracking of Wafer Grinding by Taguchi Method
碩士 === 國立高雄科技大學 === 工業工程與管理系 === 107 === In the semiconductor process, wafer grinding is the primary process of wafer processing, and it is to grind the wafer in order to reach the thickness which customer specifies.Wafer cracking is the biggest problem which is encountered in the grinding process....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/yq66a8 |