| Summary: | 碩士 === 國立彰化師範大學 === 工業教育與技術學系 === 107 === The purpose of this study is to investigate the current key performance indicator of IC lead frame product’s package manufacturing process of S company’s packaging factory in Taiwan. Through the literature invesgating, review by 5 experts and three rounds Delphi questionnaires survey by 15 experts. The data examined by using descriptive statistical analysis and Kolmogorov-Smirnov (K-S) One Sample Test from Non-parametric statistics to confirm the appropriateness of the key indicators by Delphi expert. The study subsequently uses Kruskal-Wallis (K-W) Oneway Analysis of Variance from Non-parametric statistics to affirm the consistency of Delphi expert’s opinions of each group. According to the result of analysis, set the key performance indicator, which accord with IC lead frame products’ package manufacturing process.
To analyze the three rounds Delphi questionnaires survey carry out by this study. The result shows that the expert’s opinions of the key performance indicator of IC packaging process, 5 main structure surfaces, 22 secondary facets and 105 pointer details connotation reach a consensus.
Every pointer reach above the importance, have advisablenes.
“Production management” is the most important in 5 main structure surfaces. “Operating programe execution” is the most important in “Production line management” both “Job flow control” and “Output and delivery management” are next. “Can implement SOP operations” is the most important in pointer details of “Operating programe execution”. It shows that “Production line management” is the first priovity for IC packaging process, “and must implement SOP operations”. Achieve the research purposes of the key performance indicator of IC lead frame product’s package manufacturing process.
Finally, A recommendation is made as a reference for the subsequent study of key performance indicators for IC product packaging processes.
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