Research on Key Performance Indicators of IC Lead Frame Product Packaging Process - Taking S Company as an Example
碩士 === 國立彰化師範大學 === 工業教育與技術學系 === 107 === The purpose of this study is to investigate the current key performance indicator of IC lead frame product’s package manufacturing process of S company’s packaging factory in Taiwan. Through the literature invesgating, review by 5 experts and three rounds De...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42tk49 |