Investigating Mechanical Behaviors of Fan-Out Panel Level Packaging Structures during De-bonding
碩士 === 國立交通大學 === 機械工程系所 === 107 === This research aims to investigate the mechanical behaviors of a Fan-Out Panel Level Packaging (FOPLP) display during the fabrication process using finite element analysis. The fabrication process includes the thermal cycling process and the de-bonding process of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2018
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| Online Access: | http://ndltd.ncl.edu.tw/handle/k8528y |