Using Designing of Experiments to Determine the Optimal Sawing Parameter Setting for Assembly Die Sawing -A Case Study of X Company
碩士 === 國立交通大學 === 管理學院工業工程與管理學程 === 107 === The importance of the scribe line for wafer sawing is indispensable, it can also be regarded as the most key process that directly affecting wafer yield. By controlling the parameters of scribe line, it can improve the problems of die crack and yield loss....
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2019
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| Online Access: | http://ndltd.ncl.edu.tw/handle/5sk3tq |